The Role and Composition of Non-Conducting Thermal Paste

Thermal paste is a dense compound that improves the heat exchange between electronic components and the heat sinks in which they sit. It is a vital component in any PC or electronic device, so it’s important to choose the right one for your specific needs. This article will help you understand the role and composition of Non-conductive thermal paste, as well as how to use it properly and get the most out of it.

When choosing a Non-conductive thermal paste, be sure to select one that is designed for your specific CPU or GPU and is recommended by the manufacturer. Also, look for a product with longevity and stability that will not dry out or degrade over time.

Non-conductive thermal pastes are made from a polymer base with a thermally conductive filler, usually carbon micro-particles, aluminum oxide, boron nitride, or zinc oxide. The filler raises the thermal conductivity of the base matrix by up to 80%. The most important thing to remember when using a Non-conductive thermal paste is that it must be spread evenly over the surface of the heat sink and into any air gaps. This ensures even heat transfer and prevents hot spots.

If you are not sure whether your thermal paste is conductive or not, perform a simple test with a multimeter. Simply hold the wires of the meter at two points on the surface where you have applied the paste and measure the resistance. The higher the resistance, the more conductive it is.